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NTLJD2105L
Power MOSFET
8 V, 4.3 A, m Cool ] High Side Load Switch
with Level Shift, 2x2 mm WDFN Package
Features
? WDFN 2x2 mm Package with Exposed Drain Pads Offers Excellent
Thermal Performance
? Low R DS(on) P?Channel Load Switch with N?channel MOSFET for
Level Shift
? N Channel Operated at 1.5 V Gate Drive Voltage Level
? P Channel Operated at 1.5 V Supply Voltage
? Same Footprint as SC88
? Low Profile (<0.8 mm) Allows it to Fit Easily into Extremely Thin
V INMAX
20 V
http://onsemi.com
R DS(on) MAX
50 m W @ 4.5 V
60 m W @ 2.5 V
80 m W @ 1.8 V
115 m W @ 1.5 V
I L MAX
4.3 A
?
?
Environments
ESD Protection
These are Pb?Free Devices
4
Q2
2, 3
Applications
? High Slide Load Switch with Level Shift
? Optimized for Power Management in Ultra Portable Equipment
5
Q1
6
MOSFET(Q2) MAXIMUM RATINGS
(T J = 25 ° C unless otherwise stated)
1
Parameter
Symbol
Value
Unit
Q2 Input Voltage (V DS , P?Channel)
Q1 On/Off Voltage (V GS , N?Channel)
V IN
V ON/OFF
8
6
V
V
MARKING
DIAGRAM
2 JN M G 5
Continuous Load
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I L
4.3
3.1
A
Pin 1
WDFN6
CASE 506AZ
1 6
3 G 4
Power Dissipation
Steady
T A = 25 ° C
P D
1.56
W
(Note 1)
State
JN = Specific Device Code
Continuous Load
Current (Note 2)
Power Dissipation
(Note 2)
Pulsed Load
Current
Steady
State
t p = 10 m s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I L
P D
I LM
2.5
1.8
0.52
20
A
W
A
M = Date Code
G = Pb?Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
T J ,
T STG
I S
T L
?55 to
150
?2.7
260
° C
A
° C
S1
D2
1
2
D1/G2
6 D1/G2
5 G1
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
D2
3
D2
4
S2
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
(Top View)
1. Surface?mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
2. Surface?mounted on FR4 board using the minimum recommended pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2007
March, 2007 ? Rev. 1
1
Publication Order Number:
NTLJD2105L/D
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